ConnectFlex Interconnects ConnectFlex brand interposers are based on patented technology that enables electrically transparent temporary connection between chips and test equipment. ConnectFlex advantages over competing technologies include better electrical characteristics--such as lower capacitance and inductance--and better current carrying capacity. These characteristics enable test engineers to get a clearer picture of the performance of the chip being tested--particularly with chips that operate at higher frequencies and with chips that carry more current, such as power-management chips. ConnectFlex also enables more accurate testing, and better yields in production.

Diagram of a ConnectFlex interposer with a cross sectional view ConnectFlex Cross Sectional View (Approximately 76 times actual size.)